Qoltec 51646, 3,17 W/mK, 0,067 °C/W, 0,5 g, 1 stk

Efficient thermally conductive paste, characterized by both high thermal conductivity and high insulation. Perfectly fills the connections and micro-gaps between the processor and the basis of the cooling system. The paste is very easy to apply. It can be used for a long time without having to be replaced. It does not lose its properties.